Wang Jingli

wangjingli0715@163.com

THE Chinese University of Hong Kong, Shenzhen (CUHK-Shenzhen) and New York City’s Columbia University have signed an agreement to deepen cooperation in talent cultivation as well as student and faculty exchanges.

The two universities signed an agreement on a 3+2 combined bachelor’s and master’s degree program, which is scheduled to be launched this autumn.

The academic cooperation program is primarily focused on the fields of engineering and applied sciences. Under this program, students will spend their first three years at CUHK-Shenzhen. During this period, they will have the opportunity to engage in learning and research activities alongside esteemed faculty members from Columbia University’s prestigious Fu Foundation School of Engineering and Applied Science (Columbia Engineering).

Subsequently, students will move to Columbia Engineering in the fourth year, followed by enrollment in a master’s degree program at Columbia Engineering in the fifth year after fulfilling bachelor’s degree program requirements at CUHK-Shenzhen.

Upon the successful fulfillment of graduation criteria at both institutions, students will receive a bachelor’s degree from CUHK-Shenzhen and a master’s degree from Columbia University.

So far, nearly 180 graduates from CUHK-Shenzhen have pursued master’s or doctoral programs at Columbia University. CUHK-Shenzhen boasts 254 international collaboration programs with top universities such as the University of Cambridge, the University of Oxford, and Yale University.