CHINA’S first near-memory computing 3D artificial intelligence chip was recently unveiled in Shanghai by AI chip startup Dongfang Suanxin, marking an important step forward in the nation’s efforts to develop independent, high-end computing hardware.

Formally named DF1000, the chip enters the market at a time when computing power has become a crucial pillar of national competitiveness and a key driver of industrial growth. As global technological competition intensifies and external supply chain constraints tighten, China faces significant hurdles in obtaining high-end AI chips and advanced semiconductor manufacturing capabilities, according to industry experts.

The new chip addresses a fundamental bottleneck in chip design: memory access speed. In traditional computers, data constantly travels back and forth between a separate processor and memory, creating a slowdown known as the “memory wall.” Dongfang Suanxin’s chip uses near-memory computing — placing memory components directly alongside the processing unit — and stacks them vertically in a 3D design. This structure significantly speeds up data transfer while lowering power consumption, allowing high performance without relying on ultra-advanced manufacturing equipment.

“As the nation’s first software-defined 3D AI chip powered by near-memory computing technology, its launch marks an important step toward overcoming one of the key bottlenecks in high-end computing chips, namely their dependence on advanced semiconductor manufacturing processes,” said Wei Shaojun, chairman and CEO of Dongfang Suanxin.

The technology behind the chip builds on more than two decades of research. Founded on May 20, 2024, Dongfang Suanxin specializes in integrated circuit design, focusing on self-sufficient software ecosystems and original hardware architectures.

Looking ahead, the company plans to introduce next-generation chips designed for AI model training — the computing-heavy process where AI algorithms learn from massive datasets.(SD-Agencies)